Photonic curingWikipedia
Photonic curing is the high-temperature thermal processing of a thin film using pulsed light from a flashlamp. When this transient processing is done on a low-temperature substrate such as plastic or paper it is possible to attain a significantly higher temperature than the substrate can ordinarily withstand under an equilibrium heating source such as an oven.
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Truly Low Temperature Sintering of Printed Copper Ink
Sep 25 2018 · A simple truly low temperature (130 °C) easy to scale process is reported by using formic acid to sinter structures that are inkjet‐printed using an industrial scale CuNP ink. Electrical conductivity of up to 16 bulk Cu is observed when sintering is carried out at 130 °C and more than 25 bulk Cu conductivity is observed above 150 °C.
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Truly Low Temperature Sintering of Printed Copper Ink
Sep 25 2018 · A simple truly low temperature (130 °C) easy to scale process is reported by using formic acid to sinter structures that are inkjet‐printed using an industrial scale CuNP ink. Electrical conductivity of up to 16 bulk Cu is observed when sintering is carried out at 130 °C and more than 25 bulk Cu conductivity is observed above 150 °C.
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A Review on Intense Pulsed Light Sintering Technologies
Feb 15 2020 · Intense pulsed light (IPL) sintering or annealing technology has attracted tremendous attention from many researchers and a variety of industries owing to its unique features. In IPL process the pulsed white flash-light from xenon lamp is irradiated on the target materials and converts it to the desired conductive layer. The IPL process is ambient condition and room temperature process.
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Printed highly conductive Cu films with strong adhesion
Dec 12 2016 · Low-energy photonic sintering of printed Cu nanoink on low-Tg substrates was investigated in this work. High conductivities of 28 and 44 μΩ cm were obtained on PEN and PET substrates respectively. It was found that the effective sintering at low IPL energy was due to the much thinner oxide shells wrapping the copper nanoparticles.
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IR-sintering efficiency on inkjet-printed conductive
Jan 05 2016 · When printing conductive structures on paper alternative photonic sintering methods such as IR-sintering show some attractive characteristics. IR-sintering is compatible with roll-to-roll fabrication providing low-cost fast and localized sintering which makes it suitable for fibre-based substrates (Tobjörk et al. 2012 3 ).
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Mar 11 2015 · Sintering for Printed Electronics Sintering is achieved by both presented technologies Depending on the process and application one or a combination can be selected Standard approach Thermal sintering(10 bulk Ag) after 10 min Faster alternative Photonic sintering(12 bulk Ag) after < 10 s Evolution on nanoparticle scale 1.
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Photonic sinteringan example photonic curing of silver
Jan 01 2010 · Photonic curing is a new technology that allows the sintering of nanoparticles upon low temperature substrates in less than 2 ms. Studies of the sintered density and resistivity of silver nanoparticle films sintered using photonic curing have been conducted and compared with traditional sintering methods.
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LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED
Nov 19 2015 · LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED ELECTRONICS Dr. Saad Ahmed . XENON Corporation . November 19 2015
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Speakers Printed Electronics USA 2020 1819 Nov
On Printed Flexible Structural Hybrid Electronics November 1819 2020 Santa Clara Convention Center CA USA. PART OF THE. Toggle Low Temperature Photonic Sintering For Printed Electronics. Santa Clara Convention Center CA USA. Exhibition Theater. 21 November 2019.
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Photonic Sintering of Aerosol Jet Printed Lead Zirconate
Apr 20 2016 · The highest measured substrate temperature during photonic sintering was 170.7°C enabling processing on low melting point substrates. Ferroelectric measurements were performed with a low‐frequency sinusoidal signal. The remanent polarization (P r) and coercive field (E c) for thermally sintered PZT film were 17.1 μC/cm 2 and 6.3 kV/cm
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Inkjet printed paper based frequency selective surfaces
In order to study the potential of low-pressure argon plasma and IPL low temperature sintering on tattoo and PEL paper comparison is first made to conventional thermal sintering. Based on the thermal stability analysis conventional thermal sintering temperature was limited to 135 °C for tattoo paper and 150 °C for PEL paper. 3.3.1.
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Inkjet printing and low temperature sintering of CuO and
Inkjet printing and low temperature sintering of CuO and CdS as functional electronic layers and Schottky diodes Nenad Marjanovic a Jens Hammerschmidt ab Jolke Perelaer c Stan Farnsworth d Ian Rawson d Mahmut Kus e Esma Yenel e Serhad Tilki
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Truly Low Temperature Sintering of Printed Copper Ink
Sep 25 2018 · A simple truly low temperature (130 °C) easy to scale process is reported by using formic acid to sinter structures that are inkjet‐printed using an industrial scale CuNP ink. Electrical conductivity of up to 16 bulk Cu is observed when sintering is carried out at 130 °C and more than 25 bulk Cu conductivity is observed above 150 °C.
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Photonic SinteringRevolution-Green
Dec 01 2015 · Sintering is the fusing of nanoparticles to form a solid functional thin-film that can be used for many purposes and the process could have considerable value for new technologies. Photonic sintering has the possible advantage of higher speed and lower cost compared to other technologies for nanoparticle sintering.
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Low-Thermal-Budget Photonic Processing of Highly
In the developing field of printed electronics nanoparticle based inks such as CuO show great promise as a low-cost alternative to other metal-based counterparts (e.g. silver). In particular CuO inks significantly eliminate the issue of particle oxidation before and during the sintering process that is prevalent in Cu-based formulations. We report here the scalable and low-thermal-budget
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Photonic sinteringan example photonic curing of silver
Jan 01 2010 · Photonic curing is a new technology that allows the sintering of nanoparticles upon low temperature substrates in less than 2 ms. Studies of the sintered density and resistivity of silver nanoparticle films sintered using photonic curing have been conducted and compared with traditional sintering methods.
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Potential for Multi-functional Additive Manufacturing
al. (2012) describe the use of photonic curing for printed RFID tags as well as thin-film transistors on polymer substrates. Reinhold et al. (2013) describe recent advances in high speed pulsed photonic curing of copper oxide inks printed on low temperature polymer or even paper substrate materials for printed electronics.
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IR-sintering efficiency on inkjet-printed conductive
Jan 05 2016 · When printing conductive structures on paper alternative photonic sintering methods such as IR-sintering show some attractive characteristics. IR-sintering is compatible with roll-to-roll fabrication providing low-cost fast and localized sintering which makes it suitable for fibre-based substrates (Tobjörk et al. 2012 3 ).
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Silver Nanoparticles Based Ink with Moderate Sintering in
Recently Wolf et al. reported that low pressure Ar plasma sintering resulted in the conductivity of printed patterns equal to 11 of bulk silver after only 1 min of exposure and 40 of bulk silver after 60 min of exposure while the processing temperature was below 70 °C.
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3D Conformal Printing and Photonic Sintering of High
Jul 18 2019 · Within seconds of photonic sintering the electrical conductivity of the printed film is dramatically improved from nonconductive to 2.7 10 4 S m −1. The films demonstrate a room temperature power factor of 730 µW m −1 K −2 which is among the highest values reported in
Get PriceOne-step photonic curing of screen-printed conductive Ni
Feb 09 2021 · The usage of Cu is limited since it is prone to oxidation at low temperatures 59. G. et al. Photonic flash sintering of ink-jet-printed back electrodes for organic photovoltaic applications.
Get PriceLow-Thermal-Budget Photonic Processing of Highly
In the developing field of printed electronics nanoparticle based inks such as CuO show great promise as a low-cost alternative to other metal-based counterparts (e.g. silver). In particular CuO inks significantly eliminate the issue of particle oxidation before and during the sintering process that is prevalent in Cu-based formulations. We report here the scalable and low-thermal-budget
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effectively sintering in a matter of
traces. Printing conductive traces and photonic sintering is conversely a simple additive process where no additional chemicals are used or material wasted and therefore can be considered as clean technology. Current common practice for sintering nanoparticles is to use a low temperature oven for tens of minutes set at a sufficient temperature
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(PDF) Inkjet printing and low temperature sintering of CuO
semiconducting cadmium sulfide (CdS) quantum dots under ambient conditions and at low temperature to form functional thin films which were used for the fabrication of Schottky diodes. Inkjet printed
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Low thermal budget photonic processing of highly
article osti_ title = Low thermal budget photonic processing of highly conductive Cu interconnects based on CuO nanoinks. Potential for flexible printed electronics author = Rager Matthew S. and Aytug Tolga and Veith Gabriel M. and Joshi Pooran C. abstractNote = The developing field of printed electronics nanoparticle based inks such as CuO show great promise as a low
Get PricePhotonic sintering process of ink-jet printed conductive
Current paper focuses on low-temperature photonic sintering process. The influence of different parameters like pulses number or distance between sample and lamp on the sintering process was
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Aerosol printing and photonic sintering of bioresorbable
Ko S H Pan H Grigoropoulos C P et al. All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles. Nanotechnology 2007 18 345202. Article Google Scholar 17
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Photonic Curing of Low-Cost Aqueous Silver Flake Inks for
Photonic Curing of Low-Cost Aqueous Silver Flake Inks for Printed sintering methods are available including pure thermal curing or a range of Ohmic optical and plasma- or microwave-assisted printed layer to a much higher temperature than the substrate.27 Photonic curing is commonly used where there is a need to keep flexible
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