Thermal Derating Curves For Logic-Products Packages (Rev. B
Thermal metrics such as θJA and θJC are used to compare thermal performance of plastic integrated circuit (IC) packages. The thermal conductivity of all materials of the IC packaging and of the test board affect the thermal resistance values reported by semiconductor manufacturers.
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DS3231 datasheet(2/20 Pages) MAXIM Extremely Accurate
Exposure toabsolute maximum rating conditions for extended periods may affect device reliability. datasheet search datasheets Datasheet search site for Electronic Components and Semiconductors integrated circuits diodes and other semiconductors.
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SLLS047M –FEBRUARY 1989–REVISED NOVEMBER 2014
(1) For more information about traditional and new thermal metrics see the IC Package Thermal Metrics application report (SPRA953). 7.4 Thermal Information THERMAL METRIC(1) MAX232xD MAX232xDW MAX232xN MAX232xNS SOIC SOIC wide PDIP SOP UNIT 16 PINS 16 PINS 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 73 57 67 64 °C/W
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MAX4936 datasheet(2/19 Pages) MAXIM Octal High-Voltage
MAX4936 Datasheet (PDF) 2 PageMaxim Integrated Products. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional. operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications
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MAX31855JASA datasheet(2/13 Pages) MAXIM Cold-Junction
Maxim Integrated Products 2MAX31855Cold-Junction CompensatedThermocouple-to-Digital ConverterSupply Voltage Range (VCC to GND)..-0.3V to 4.0VAll Other Pins.. -0.3V to (VCC 0.3V)Continuous Power Dissipation (TA = 70NC)SO (derate 5.9mW/NC above 70NC)..470.6mWESD Protection (All Pins Human Body Model)..±2000kVOperating Temperature Range.. -40NC to
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General Thermal Analysis of Integrated Circuits for Power
May 13 2019 · Thermal analysis is a branch of materials science which studies the characteristics of materials as a function of temperature. All integrated circuits generate heat when subjected to a voltage. Therefore to maintain the junction temperature of the device below the maximum admitted value an estimation of the heat flow through the package shall
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Thermal Characteristics of Linear and Logic Packages
a package in a specific end-use environment. Thermal metrics such as θJA and θJC are used to compare thermal performance of plastic IC packages. The thermal conductivity of all materials of the IC package and the test-board influence the thermal-resistance values reported by
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Rev 0 9/11 MAX2090 50MHz to 1000MHz Analog
Maxim Integrated Products 3 MAX2090 50MHz to 1000MHz Analog VGA and Power Detector with Optional AGC Loop AC ELECTRICAL CHARACTERISTICS (Typical Application Circuit with analog attenuator set to minimum attenuation VCC = 4.75V to 5.8V fRF = 350MHz -40NC < TC < 95NC and RF ports are connected to 50I sources unless otherwise noted.
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1A 76V High-Efficiency MAXPower Step Maxim Integrated
on-resistance high-voltage DMOS transistor to obtain high efficiency and reduce overall system cost. This device includes undervoltage lockout cycle-by-cycle current limit hiccup mode output short-circuit protec-tion and thermal shutdown. The MAX5035 delivers up to 1A output current. The out-put current may be limited by the maximum power dis-
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Rev 0 9/11 MAX14759/MAX14761/MAX14763
PACKAGE THERMAL CHARACTERISTICS(Note 1) ELECTRICAL CHARACTERISTICS (VCC = 3.0V to 5.5V TA = -40°C to 85°C unless otherwise noted. Typical values are at VCC = 5V and TA = 25°C.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS Power Supply Range VCC 3.0 5.5 V Continuous Current Through Switch IA_ (MAX14759) -500
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DS3231 datasheet(2/20 Pages) MAXIM Extremely Accurate
Exposure toabsolute maximum rating conditions for extended periods may affect device reliability. datasheet search datasheets Datasheet search site for Electronic Components and Semiconductors integrated circuits diodes and other semiconductors.
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MAX1185ECM-TDMAXIMIC ChipsKynix Semiconductor
Offer MAX1185ECM-TD MAXIM from Kynix Semiconductor Hong Kong Limited.IC Chips . 0 Product Index Integrated Circuits (ICs) IC Chips MAX1185ECM-TD. Manufacturer Part # MAX1185ECM-TD. Product Category IC Chips. Manufacturer Maxim Integrated. Description Package TQFP-48. Quantity 23360 PCS. Lead Free Status / RoHS Status Lead free
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High-Accuracy Temperature Measurements Maxim
Maxim > Design Support > Technical Documents > Application Notes > Sensors > APP 4875 Maxim > Design Support > Technical Documents > Application Notes > Temperature Sensors and Thermal Management > APP 4875 Keywords Platinum Resistance Temperature Detectors IEC 60751 Precision Delta Sigma ADCs PT100
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DS1218 Datasheet by Maxim Integrated Digi-Key Electronics
Junction-to-Ambient Therm al Resistance PIN- RANGE PACKAGE DS1218 0°C to 70°C 8 PDIP DS1218S 0°C to 70°C 8 SO PA F0 wWw.maxim-icxom/Eackafes "#4 d PACKAGE TYPE PACKAGE CODE OUTLINE N0. LAND PATTERN N0. 8 PDIP P8 1 7 8 SO S8 2 Thermal Characteristics section added the Ordering Information. and Package
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Package Thermal Characteristics and Weights
Table 1 • Package Thermal Characteristics and Weights (continued) Package Type Pin Count jc ja Still Air Units 1.0 m/s 200 ft/min 2.5 m/s 500 ft/min 1. qjc for CQFP and CCLG packages refers to the thermal resistance between the junction and the bottom of the package.
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High-Accuracy Temperature Measurements Maxim
Maxim > Design Support > Technical Documents > Application Notes > Sensors > APP 4875 Maxim > Design Support > Technical Documents > Application Notes > Temperature Sensors and Thermal Management > APP 4875 Keywords Platinum Resistance Temperature Detectors IEC 60751 Precision Delta Sigma ADCs PT100
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High-Dynamic-Range Direct Up Maxim Integrated
For pricing delivery and ordering information please contact Maxim Direct 1 at or visit Maxim s website at maxim-ic. PART TEMP RANGE PIN-PACKAGE
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MAX31855JASA datasheet(2/13 Pages) MAXIM Cold-Junction
Maxim Integrated Products 2MAX31855Cold-Junction CompensatedThermocouple-to-Digital ConverterSupply Voltage Range (VCC to GND)..-0.3V to 4.0VAll Other Pins.. -0.3V to (VCC 0.3V)Continuous Power Dissipation (TA = 70NC)SO (derate 5.9mW/NC above 70NC)..470.6mWESD Protection (All Pins Human Body Model)..±2000kVOperating Temperature Range.. -40NC to
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A200A200 Dala aera oer rotectors
Thermal Resistance Four-Layer Board Junction-to-Ambient Thermal Resistance (θJA) 33°C/W Junction-to-Case Thermal Resistance (θJC) 2°C/W Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7 using a four-layer board. For detailed information on package thermal considerations refer to www
Get PriceThermal Resistance Analysis of Chip Packaging Develop Paper
ThetaJC the thermal resistance to the package shell = (Tj-Tc)/P is generally the thermal resistance to the top of the package so generally ThetaJC = ThetaJT ThetaJB thermal resistance to PCB = (Tj-Tb)/P
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1A 76V High-Efficiency MAXPower Step Maxim Integrated
on-resistance high-voltage DMOS transistor to obtain high efficiency and reduce overall system cost. This device includes undervoltage lockout cycle-by-cycle current limit hiccup mode output short-circuit protec-tion and thermal shutdown. The MAX5035 delivers up to 1A output current. The out-put current may be limited by the maximum power dis-
Get PriceHigh-Dynamic-Range Direct Up Maxim Integrated
For pricing delivery and ordering information please contact Maxim Direct 1 at or visit Maxim s website at maxim-ic. PART TEMP RANGE PIN-PACKAGE
Get PriceThe Ultimate Guide to QFN PackageAnySilicon
QFN Thermal Characteristics . The QFN package exposed pad (or paddle) offers a low thermal resistance path for heat transfer to the PCB and therefore it s recommended to solder the exposed pad to a large conductive surface such as GND plane. This path carries approximately 70 of the heat away from the Package.
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Package Thermal Characteristics and Weights
Table 1 • Package Thermal Characteristics and Weights (continued) Package Type Pin Count jc ja Still Air Units 1.0 m/s 200 ft/min 2.5 m/s 500 ft/min 1. qjc for CQFP and CCLG packages refers to the thermal resistance between the junction and the bottom of the package.
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Thermal Derating Curves For Logic-Products Packages (Rev. B
Thermal metrics such as θJA and θJC are used to compare thermal performance of plastic integrated circuit (IC) packages. The thermal conductivity of all materials of the IC packaging and of the test board affect the thermal resistance values reported by semiconductor manufacturers.
Get Price
Package Thermal Resistance Values (Theta JA Theta JC) for
Package Thermal Resistance Values (Theta JA Theta JC) for Dallas Semiconductor Temperature Sensors Abstract Two common thermal-resistance values measured for IC packages are junction to ambient (Theta JA) and junction to case (Theta JC). These parameters are useful for calculating maximum power dissipation
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Rev 2 2/12 MAX31855 Cold-Junction Compensated
PACKAGE THERMAL CHARACTERISTICS(Note 1) RECOMMENDED OPERATING CONDITIONS (TA = -40NC to 125NC unless otherwise noted.) DC ELECTRICAL CHARACTERISTICS (3.0V P VCC P 3.6V TA = -40NC to 125NC unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Power-Supply Voltage VCC (Note 2) 3.0 3.3 3.6 V Input Logic 0 VIL -0.3 0.8 V
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Thermal Characteristics of Linear and Logic Packages
a package in a specific end-use environment. Thermal metrics such as θJA and θJC are used to compare thermal performance of plastic IC packages. The thermal conductivity of all materials of the IC package and the test-board influence the thermal-resistance values reported by
Get Price
Thermal Characterization of IC PackagesTutorialMaxim
ΘJA is the thermal resistance from junction to ambient measured as °C/W. Ambient is regarded as thermal "ground." ΘJA depends on the package board airflow radiation and system characteristics. Generally the effects of radiation are negligible. ΘJA values are listed for natural convention conditions (no forced air) only. ΘJC is the thermal resistance from junction to case.
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